Laser Waterjet Solution

TECHNICAL SPECIFICATIONS

Machine WPX70
Type Water Guided Laser System
Main Applications Sawing, Pie Cutting, Fancy Shaping, Faceting, Drilling
Axis Working Volume - L × B × H (mm) 75 × 75 × 90
Linear Axis X / Y : Linear Motor Z : Ball Screw
Rotary Axis (A) 4 Axis : Rotary
Rotary Axis (C) 5 Axis : Rotary
Maximum - X,Y,Z Stroke (min) 170 × 170 × 90
Accuracy um (X,Y,Z) ±3
Repeatibiity um (X,Y,Z) ±1
Laser Laser Type Diode Pumped Solid State Nd: YAG, Pulsed
Wavelength (mm) 532
Average Power (W) 50 / 100
Beam Transmission (um) 120
Water Pump Water Flow for Jet l/h 01 / 10
Water Pressure (bar) 500 / 800
Nozzle Diameter (um) 30 - 60
Utility Electric Power (VAC) 1 × 230
Frequency (Hz) 50 / 60
Connected Load (KVA) 10
Compressed Air Bar (min) 6 to 8
Dimensions / Weight Dimension Machine - W × D × H (mm) 1020 × 880 × 1875
Dimension Utility - W × D × H (mm) 1950 × 750 × 900
Weight (Kg) 400
Weight for Utility (Kg) 300
Transforming the diamond cutting industry with unparalleled efficiency, the WPX diamond machine is your one-stop solution for all diamond p r o c e s s i n g n e e d s . F e a t u r i n g revolutionary WLG technology, the WPX delivers exceptional surface smoothness and minimizes weight loss with its narrow beam kerf, eliminating V-shape concerns. Its integrated technology ensures unmatched precision and consistent, high-quality cuts without heat damage. The WPX seamlessly integrated software and advanced hardware maximize productivity and efficiency, making it the ultimate state-of-the- art solution for modern diamond p ro c e s s i n g . Fo r p ro fe s s i o n a l s seeking excellence, the WPX is the pinnacle of performance

FEATURES

APPLICATIONS

Responsive Comparison Layout
WLG TECHNOLOGY
CONVENTIONAL LASER
WLG Image 1

A high aspect ratio with very small kerf width and minimal material loss

Laser Image 1

Constraints on the cutting aspect ratio

WLG Image 2

Particle deposition and contamination are eliminated by a thin water film removing the need for a surface protective layer

Laser Image 2

Particle deposition and contamination are frequent occurrences

WLG Image 3

Precise focus adjustment is not necessary

Laser Image 3

Precise focus adjustment is necessary

WLG Image 4

Parallel kerf walls due to cylindrical beam

Laser Image 4

Non-parallel kerf walls due to conical laser beam

WLG Image 5

Diamond quality is improved and breakage in high-risk diamonds is decreased by the water-cooling process

Laser Image 5

A higher heat-affected zone makes diamonds less lustrous

WLG Image 6

The water jet's high kinetic energy blows away molten material without causing burrs

Laser Image 6

Ineffective removal of material results in burrs

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