| Machine | WPX70 | |
|---|---|---|
| Type | Water Guided Laser System | |
| Main Applications | Sawing, Pie Cutting, Fancy Shaping, Faceting, Drilling | |
| Axis | Working Volume - L × B × H (mm) | 75 × 75 × 90 |
| Linear Axis | X / Y : Linear Motor Z : Ball Screw | |
| Rotary Axis (A) | 4 Axis : Rotary | |
| Rotary Axis (C) | 5 Axis : Rotary | |
| Maximum - X,Y,Z Stroke (min) | 170 × 170 × 90 | |
| Accuracy um (X,Y,Z) | ±3 | |
| Repeatibiity um (X,Y,Z) | ±1 | |
| Laser | Laser Type | Diode Pumped Solid State Nd: YAG, Pulsed |
| Wavelength (mm) | 532 | |
| Average Power (W) | 50 / 100 | |
| Beam Transmission (um) | 120 | |
| Water Pump | Water Flow for Jet l/h | 01 / 10 |
| Water Pressure (bar) | 500 / 800 | |
| Nozzle Diameter (um) | 30 - 60 | |
| Utility | Electric Power (VAC) | 1 × 230 |
| Frequency (Hz) | 50 / 60 | |
| Connected Load (KVA) | 10 | |
| Compressed Air Bar (min) | 6 to 8 | |
| Dimensions / Weight | Dimension Machine - W × D × H (mm) | 1020 × 880 × 1875 |
| Dimension Utility - W × D × H (mm) | 1950 × 750 × 900 | |
| Weight (Kg) | 400 | |
| Weight for Utility (Kg) | 300 |
The advanced WLG technology optimizes the cutting process, allowing for precise shaping of diamonds with minimal waste. This technology ensures consistent, high-quality results, reducing the need for manual intervention and significantly increasing overall efficiency.
With WLG technology, the process of bruiting is enhanced, allowing for precise shaping of diamonds into round stones with minimal waste. The technology ensures consistent results, reducing the need for manual intervention and increasing overall efficiency.
WLG technology optimizes the sawing process by providing clean and accurate cuts through rough diamonds. This precision reduces material loss and improves the quality of the finished gemstone, making it an essential tool for high-volume production.
WLG technology aids in the blocking stage by accurately shaping the diamond into its final outline. This technology ensures perfect symmetry and proportions, leading to a higher quality and more valuable final product.
In coring, WLG technology offers unparalleled accuracy, enabling the extraction of core samples with minimal damage to the surrounding material. This precision is crucial for maintaining the integrity and value of the diamond.
Using WLG technology for slicing ensures that diamonds are cut into thin, even slices with high precision. This technology minimizes waste and maximizes yield, making the process more cost-effective and efficient.
WLG technology streamlines the shaping process, allowing for complex and intricate designs to be created with ease. The precision and control offered by this technology result in superior quality and consistency in the final product.
A high aspect ratio with very small kerf width and minimal material loss
Constraints on the cutting aspect ratio
Particle deposition and contamination are eliminated by a thin water film removing the need for a surface protective layer
Particle deposition and contamination are frequent occurrences
Precise focus adjustment is not necessary
Precise focus adjustment is necessary
Parallel kerf walls due to cylindrical beam
Non-parallel kerf walls due to conical laser beam
Diamond quality is improved and breakage in high-risk diamonds is decreased by the water-cooling process
A higher heat-affected zone makes diamonds less lustrous
The water jet's high kinetic energy blows away molten material without causing burrs
Ineffective removal of material results in burrs

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