When considering applications in the semiconductor industry, WLG Technology presents numerous benefits over traditional diamond blade saws or laser systems.
WLG’s innovative technology delivers unparalleled precision in cutting, grooving, and dicing of sensitive materials. Our advanced process produces exceptionally smooth edges, maximizing wafer strength while minimizing breakage risk.
Our versatile solution accommodates a wide range of semiconductors, including silicon, gallium arsenide, silicon carbide, low-K materials, and coated compounds of varying thicknesses. By enabling multi-directional 2D cutting, WLG empowers engineers to create diverse chip shapes, from traditional die patterns to complex T-cuts and circular designs.
Leveraging different laser sources (Green, UV, IR), our technology adapts to future applications. WLG systems are cost-effective, requiring minimal consumables and zero tool wear. High throughput, especially for thin wafers, combined with virtually damage-free processing (no HAZ, chipping, micro-cracks, burrs, or deposition), significantly enhances yield and reduces overall costs.